Slim 4G LTE embedded module is only 2.5-mm thick

June 11, 2012 // By Jean-Pierre Joosting
Sierra Wireless claims to offer the first thin form factor (TFF) embedded wireless module for 4G LTE networks.

The AirPrime™ EM7700 embedded wireless module measures only a nominal 2.5 millimeters thick and is designed for use in ultraportable notebooks, tablets, and other devices where thinness is a critical design constraint. Shipments are expected to begin in the second quarter of this year.

Made exclusively for connecting to the AT&T 4G LTE network, the AirPrime EM7700 is based on the AirPrime MC7700 module, which was certified by AT&T last year. Designed to support Windows 8, the AirPrime EM7700 utilizes Qualcomm’s Gobi™ 4G LTE modem, the MDM9200™, and is compatible with Qualcomm’s computing API and the USB-IF Mobile Broadband Interface Model (MBIM) for easy integration by PC OEMs. It offers a connectorized interface to enable build-to-order logistics, allowing manufacturers to offer it as an optional add-on to their devices. The AirPrime EM7700 also supports HSPA+ on the AT&T network for use in areas where LTE is not yet available.

Sierra Wireless is working with leading OEMs to integrate the AirPrime EM7700 embedded wireless module into a variety of devices, including tablets and ultra-portable devices expected to reach the market later this year.

www.sierrawireless.com