Smaller power MOSFETs relative to conventional chips, with better thermal dissipation

April 23, 2013 // By Graham Prophet
Available from distributor TTI, Panasonic Power CSP MOSFETs incorporate a unique pad design into new series and drain clip technology that enables thermal dissipation to be improved by 5% in an 80% smaller footprint than conventional solutions.

The CSP MOSFET Series achieves higher power efficiency at the same time as reducing power consumption of the system by using Panasonic’s advances in cell technology and wafer thinning fabrication – its silicon now has a 110-nm fine-trench cell which gives 47% lower RDS(on) over the same sized conventional chip. Panasonic’s Power CSP MOSFETS are halogen free, have lead-free solder bumps and are RoHS and AEC-Q101 qualified. Two versions are currently available, FJ3P02100L and FJ3P02100L. Package sizes are FJ3P02100L: 2.0 x 2.0 x 0.33mm and FK3P02110L: 1.8 x 1.6 x 0.33mm. Suitable applications include portable gaming devices, hand sets, audio players; smaller medical devices such as hearing aids and blood glucose monitors; IT applications such as servers, routers and adapters; and meters and IC cards.

Further information; www.ttieurope.com/object/Panasonic_Power_CSP_MOSFETs