For transistors packages, in addition to technical challenges such as bonding stability and package processing accuracy, it has been difficult to increase element size, resulting in higher ON resistances and a maximum withstand voltage of only 20V. Rohm has been able to successfully reduce package size and ON resistance while improving voltage resistance up to 60V, providing breakthrough performance and applicability.
This new package will be expanded to small-signal MOSFETs, contributing to increased space-savings in a variety of sets.
A precise 0.2mm terminal spacing improves mountability; as devices become smaller substrate mounting becomes increasingly - Rohm maintained a 0.2 mm terminal gap that facilitates mounting using existing equipment.
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