Designers can stack two converters in parallel to drive loads up to 70A for processors in space-constrained and power-dense applications. The converter is 44% denser (amperes per square millimeter) than alternative devices. It features 0.5% reference-voltage accuracy over temperature and full differential remote-voltage sensing to meet the voltage accuracy requirements of deep sub-micron processors. Current sharing enables the stacking of two converters and efficiency and thermal performance are delivered via the device’s single-pad, stacked die, quad flat no-lead (QFN) package. Read the blog post, “Stack current with PowerStack packages for higher POL.”
TI also offers the TPS546C20A PMBus converter that supports pin-strapping for both the output voltage and soft-start time.
TPS546C23 features include on-chip PMBus interface and non-volatile memory to simplify power-supply design and enable customization. Output current, output voltage and internal die temperature telemetry is supported via PMBus to facilitate active power management. Voltage-control mode with clock frequency synchronization and input feed-forward improves EMI/noise and responds rapidly to input-voltage changes. Frequency synchronization to an external clock eliminates beat noise and reduces electromagnetic interference (EMI).
In a 40-pin, 5 x 7 x 1-mm PowerStack QFN package the device is priced at $4.62 (1,000). There is an evaluation module .