Startup offers all-in-one 2G/3G/4G front-end

December 22, 2015 // By Peter Clarke
Morfis Semiconductor Inc. (Irvine, Calif.), a startup founded in 2013, has announced it has developed a single-die flip-chip RF front end to support all 2G/3G/4G LTE frequency bands.

The chip does this without compromising efficiency and linearity the company claims in a press release. The company plans to exhibit at the Consumer Electronics Show to take place in Las Vegas in January and to show there a multi-mode, multiband power amplifier and its RF front-end. Morfis is sampling special customers and mass production is scheduled to start in 2Q16.

The company staff has been drawn from other RF companies in the area according to LinkedIn filings. Charlie Chen is CTO and was previously engineering fellow and director of engineering at RF Axis Inc. (Irvine, Calif.). Yun Shi, who was previously with Qualcomm, is director of operations and Zhan Xu, previously with TriQuint Semiconductor, is an engineering fellow at Morfis.

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