ST’s THELMA MEMS manufacturing process available for prototyping through CMP

March 21, 2013 // By Julien Happich
STMicroelectronics and CMP (Circuits Multi Projects) are now making ST's THELMA MEMS manufacturing process available for prototyping to universities, research labs and design companies through the silicon brokerage services provided by CMP.

The 0.8-micron, surface micro-machining THELMA (Thick Epitaxial Layer for Micro-gyroscopes and Accelerometers) process combines variably thick and thin poly-silicon layers for structures and interconnections. This enables the integration of linear and angular mechanical elements in a single chip, delivering significant cost and size benefits to customers.

The CMP multi-project wafer service allows organizations to obtain small quantities, typically from a few dozens to a few thousand units, of advanced ICs manufactured using the same process technologies as would be used on much higher-volume products. The THELMA process design rules and design kits are now available for universities and microelectronics companies and the first requests are already being answered.

“The small-scale availability of our industry-leading MEMS process alongside CMOS technologies including the game-changing FD-SOI, complemented with CMP’s advanced service capabilities, offers unprecedented access to state-of-the-art in chip manufacturing for start-ups and R&D labs looking to design intelligent sensor systems,” said Benedetto Vigna, Executive Vice President, General Manager, Analog, MEMS & Sensors Group, STMicroelectronics. “With leading-edge industrialized processes at their fingertips, innovators can now concentrate on developing new products rather than investing time and resources in developing technologies.”

Visit STMicroelectronics at www.st.com

Visit CMP at http://cmp.imag.fr