Taiwanese SSD maker trials 3D NAND flash technology for embedded sockets

August 09, 2016 // By Graham Prophet
ATP Electronics (Taipei, Taiwan), maker of embedded flash and ruggedized SSD and DRAM modules, has announced its next generation of storage solutions using the latest 3D NAND flash technologies. Wafer packaged NAND flash storage, it says, provides added supply flexibility and product differentiation

Combined with ATP’s wafer packaging and testing capabilities, these new lines of 3D NAND based SSDs including M.2, mSata, SlimSata, 2.5-in. SSD, eUSB and memory cards, provides a new level of product differentiation targeting the industrial and embedded markets.


3D NAND technology, ATP adds, is a transformational shift from the traditional SLC/MLC/TLC planar NAND technologies. It has become the new flash storage technology of choice, primarily focusing on both the client and enterprise SSD markets today. 3D NAND usage will propagate to the embedded markets such as industrial, IoT, medical, automotive and telecom. ATP has adopted 3D NAND for its next generation embedded SSDs, to build experience of 3D NAND under extreme conditions, in order to better provide the solutions suitable for these niche markets where traditionally SLC/MLC technologies were deployed. In addition, by taking 3D NAND wafers to package its own BGAs and TSOPs and testing to specifications, ATP is able to provide multiple chip densities using DDP, QDP and even ODP die-stacking while using the same wafer stock. This provides not only the flexibility in supply chain, but also enables ATP to ramp multiple product densities quickly. These new ATP 3D NAND solutions benefit the embedded customers with the high reliable, high available yet cost-effective storage solutions while mitigating supply risks in this volatile market.


ATP; www.atpinc.com