Tensilica expands strategic relationship to develop next-generation products

February 25, 2013 // By Paul Buckley
Tensilica, Inc. has strengthened the company's strategic relationship with Huawei.

HiSilicon, the semiconductor division of Huawei, is expanding its use of Tensilica’s DPUs (dataplane processor units), including Tensilica’s Xtensa customizable processor technology, HiFi DSPs (digital signal processors) for audio and voice processing in smartphones and set-top boxes, and ConnX Baseband Engines for LTE base stations, handsets, and other network infrastructure and customer premise equipment.

“For more than four years, we have worked very closely with Tensilica on a number of projects,” expalained Teresa He, vice president of HiSilicon. “We have found that Tensilica’s DPUs can help us differentiate our products and achieve competitive advantages in terms of power, performance, and area. Tensilica cores have operated as expected and their support has been superb, enabling us to significantly speed up our development time.”

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