Thermal loads demand higher-performance thermal materials that can effectively manage heat dissipation challenges. Parker Chomerics is evolving its range of THERM-A-GAP thermally conductive dispensing gels and has extended its range of gels to offer thermal conductivity up to 6 W/m-k. Typical applications include high performance devices requiring minimal thermal resistance, ranging from automotive electronic control units (ECUs), power supplies and semiconductors, through to memory/power modules, microprocessors/graphics processors, flat panel displays and consumer electronics.
This heat removal process frequently involves conduction from a package surface to a heat spreader that can more efficiently transfer the heat away. The spreader has to be joined carefully to the package to minimise the thermal resistance of this newly formed thermal joint.
THERM-A-GAP gels are supplied as pre-cured, single component compounds that can be dispensed over the heat generating package or component. These materials are silicone-based formulations loaded with conductive fillers, which are cross-linked to form a low modulus gel.
These additions to the THERM-A-GAP range need only ultra-low compression force to conform over irregular interfaces and can be applied to single devices with minimum bond-line thickness as well as to multiple devices with variable Z-axis tolerances. The gel structure provides superior long-term thermal stability and reliable performance over conventional greases, which suffer from pump-out and dry-out issues.
Offering low thermal impedance and high bulk thermal conductivity, further advantages of the new gels include the elimination of a cure cycle and the ability to be readily reworked, thus offering a highly attractive performance-to-price ratio. They require no refrigeration, no mixing and have no ﬁller settling issues. THERM-A-GAP also eliminates time consuming hand assembly, and reduces installation costs and customer manufacturing and purchasing (logistical) complexity.