Thermal management structure is 10x times better at reducing HBLED overheating

September 07, 2015 // By Paul Buckley
ESCATEC claims to have solved the problem of overheating high brightness LEDs with the company's Heat Spreader solution that solders the LEDs onto a copper substrate, which is up to ten times more effective at dissipating the heat generated by the LEDs than current solutions.

The Heat Spreader will appear at the LED Professional Symposium 2015 in Bregenz, Austria on 22-24 September 2015.  The CoolRunning design means that LEDs with a power density of up to 10 W per mm2 could be passively cooled.
The Heat Spreader was developed in response to a customer visit to ESCATEC's FutureLab where novel and innovative solutions are developed for LED applications.  "Heat dissipation is always a challenge for LEDs as their compact size means that the LEDs can be packed close together to form a powerful illumination source but that also forms a highly concentrated heat source, for example, when one hundred 5 Amp LEDs are side by side," explained Wolfgang Plank, Manager of the FutureLab. "Our Heat Spreader solution opens up compact, high power LEDs of, say 1000W, to be used in many new applications such as stage lighting, architectural illumination and video projectors."

By starting from the bare LED die, ESCATEC can customize the solution with regards to the size of the package, the shape of the beam so that there are minimal losses, and the wavelength of the light along with its intensity.