Thin-down sensor assemblies by recessing devices in substrate cavities

February 06, 2014 // By Graham Prophet
Passives specialist Taiyo Yuden has added a capability to form a cavity or recess in its embedded-parts multilayer wiring substrate “EOMIN” technology; a key target is to allow a sensor chip to be recessed and therefore to allow the construction of thinner camera modules.

The copper-core embedded-parts multilayer wiring system can be given a cavity or depression in a part of the substrate. This product is aimed at camera modules that are mounted in compact mobile devices such as smartphones and wearable devices: requirements for substrates to possess flatness and rigidity are ever-increasing. Additional requirements include noise immunity needed to address distortion, and exclusion of noise. These characteristics are critical to support high definition features and the narrowing of the pitch of pixels in camera modules with an increasing number of pixels. The cavity formation technology maintains high accurate flatness while retaining the characteristic noise immunity and high rigidity of the EOMIN system.

Camera modules are required to be even thinner so that they can be mounted at the back of the panel in devices that use a panel with a narrow frame, in order to realize a larger screen size of the display panel while retaining a compact casing. The increase in the number of pixels to as many as 12 million has increased the size of the image sensor and the overall thickness of camera modules.

Taiyo Yuden says it sees possibilities for a further reduction in the thickness of the copper core substrate.

Taiyo Yuden; www.yuden.co.jp/eu/