The AFEs team with TI’s WEBENCH Sensor AFE Designer software and bench-top development system. The tools allow engineers to select a sensor, design and configure the solution and download configuration data to the sensor AFE for immediate prototyping.
The highly-integrated LMP91050 NDIR gas sensing AFE supports multiple thermopile sensors for NDIR sensing, indoor CO2 monitoring, demand control ventilation, HVAC, alcohol breath analysis, greenhouse gas monitoring and Freon detection.
The LMP91050 NDIR Gas Sensing AFE integrates a programmable gain amplifier (PGA), ‘dark phase’ offset cancellation circuitry, adjustable common-mode generator, and SPI interface to simplify system design. The device features low gain range and high gain range, allowing the use of thermopiles with different sensitivities.
The LMP91050 offers low gain drift of 100 ppm/degrees C (maximum), output offset drift of 1.2 mV/degrees C, phase delay variation of 500 ns, low noise at 0.1 uV rms (0.1 to 10 Hz), and operation between -40 degrees C to 105 degrees C provide optimized system performance. Integration shrinks package to 3 mm x 4.9 mm, enabling smaller end products.
The highly-integrated LMP91200 pH sensing AFE supports two electrode pH sensors used in analyzer platforms for emissions monitoring, steam and water quality monitoring, chemical/petrochemical plants, food processing and more.
The LMP91200 pH Sensing AFE integrates a PGA, ultra-low input-bias pH buffer, signal guarding, temperature and measurement calibration, and common-mode generation and diagnostics circuitry, allowing use of a single chip to interface to most of today’s pH sensors.
The device’s on-board sensor test ensures proper connection and functionality, and ultra-low bias current of 0.4 pA (maximum) boosts system reliability and accuracy while also protecting the pH electrodes during no supply situations.
Operation from 1.8 V to 5.5 V and -40 degrees C to 125 degrees C, with a guaranteed low pH buffer input bias current across the operating range, provides maximum flexibility. Integration shrinks package to 5 mm x 6.4 mm, enabling smaller end products.