TI’s Bluetooth chip range adds Bluetooth 5, & automotive qualification

January 20, 2017 // By Graham Prophet
With more available memory, Bluetooth 5-ready hardware, automotive qualification and an ultra-small wafer-chip-scale package (WCSP) option, Texas Instruments has added two devices to its scalable SimpleLink Bluetooth low energy wireless microcontroller (MCU) family.

The devices offer a complete single-chip hardware and unified software solution with an ARM Cortex-M3 based MCU, automatic power management, flexible full-featured Bluetooth-compliant radio and a low-power sensor controller.


The SimpleLink CC2640R2F wireless MCU offers more available memory in a 2.7 x 2.7 mm chip-scale package (WCSP) option that is less than half the size of TI’s smallest 4 x 4 mm QFN package. The CC2640R2F is ready for the Bluetooth 5 core specification which offers longer range, higher speed and more data.

SimpleLink CC2640R2F-Q1 is a wireless MCU that enables smartphone connectivity for car access including passive entry passive start (PEPS) and remote keyless entry (RKE), as well as emerging automotive use cases with AEC-Q100 qualification and Grade 2 temperature rating. The CC2640R2F-Q1 device is the first to be offered in a wettable flank QFN package which helps reduce production line cost and increases reliability enabled by optical inspection of solder points.


The CC264x family is supported by a unified software and application development environment, royalty-free BLE-Stack software, Code Composer Studio integrated development environment (IDE), system software and interactive training materials.


The SimpleLink CC2640R2F wireless MCUs’ highly flexible radio fully supports thenew Bluetooth 5 specifications and the accompanying software stacks will be available in the first half of 2017, making it – TI says – among the first devices in mass production with Bluetooth 5 capability.


For car access and emerging applications such as assisted parking, car sharing and in-car cable replacement, the new AEC-Q100-qualified device will support Bluetooth 5 in second half of 2017. Pre-release samples of the CC240R2F-Q1 device will be available mid-February 2017 - contact bleauto@list.ti.com


The CC2640R2F wireless MCU LaunchPad development kit (LAUNCHXL-CC2640R2) is available for $29. The CC2640R2F wireless MCU is available in 2.7 x 2.7 mm WCSP and 4 x 4, 5 x 5 and 7 x 7 mm QFN packages starting at $2.00 (1,000). The CC2640R2F-Q1 wireless