The memory modules are available in a 16 GB-version (THGBMBG7D2KBAIL), housed in a 153-ball FBGA 11.5 x 13 x 0.8mm package, and a 32 GB-version (THGBMBG8D4KBAIR), housed in a 11.5 x 13 x 1.0mm package. Modules with storage capacities of 4 GB, 8 GB, 64 GB and 128 GB will follow. All memories integrate a controller to manage basic control functions for NAND applications.
The 32 GB embedded device contains four 64 Gbit (equal to 8 GB) NAND chips. The memory modules are compliant with JEDEC e.MCC Version 5.0. The corresponding interface handles essential functions, including writing block management, error correction and driver software. It simplifies system development, allowing manufacturers to minimise development costs and speed up time to market for new upgraded products. By applying the new HS400 high speed interface standard, read/write performance is 270 MB/sec / 90 MB/sec at 32 GB, and 270 MB/sec / 50MB/sec at 16 GB. The operating temperature ranges between -25° and +85°C.