Toshiba sampling UFS Ver. 2.0 embedded NAND flash memory modules

April 29, 2014 // By Graham Prophet
Toshiba Electronics Europe has started sample shipments of 32-GB and 64-GB embedded NAND flash memory modules compliant with the JEDEC UFS Ver.2.0 standard, claiming to be the first company in the industry to do so. The product supports maximum transfer rates up to 11.6 Gbps by integrating two 5.8-Gbps High-speed MIPI M-PHY HS-G3 I/F data lanes - an optional feature of UFS Ver. 2.0.

The modules achieve ultra-high read/write performance with read speeds reaching 650 MB/sec and write speeds reaching 180 MB/sec. The faster transfer speeds can shorten the time taken to launch many kinds of application, shoot digital still images, and play and download large data movie and music files on mobile products such as smartphones or tablets.

The modules are sealed in a 153-ball FBGA package measuring 11.5 x 13.0 x 1.0 mm for the 32 GB die and 11.5 x 13.0 x 1.2 mm for the 64 GB die, and have a signal layout compliant with JEDEC UFS Ver.2.0. The modules are rated for an operating temperature of -25°C to +85°C and support memory core voltages of 2.7V to 3.6V.

The JEDEC UFS Ver.2.0 compliant interface handles essential functions, including writing block management, error correction and driver software. It simplifies system development, allowing manufacturers to minimise development cost and time. Universal Flash Storage is a product category for a class of embedded memory products built to the JEDEC UFS standard specification.