The die packaging technology is targeted at implantable medical devices such as pacemakers and cardiac defibrillators. It can also be used in wearable devices such hearing aids and intelligent patches, as well as nerve stimulators and drug delivery products.
This breakthrough packaging technology delivers a footprint reduction of approximately 75 percent over the company's currently available implantable radio modules. Device miniaturization allows physicians to use less invasive procedures, enabling faster recovery times and improvements in patient comfort while concurrently lowering health care costs. Smaller, lighter weight wireless medical devices also afford patients greater mobility.
"This internal die packaging technology qualification aligns with our customers' required parameters, providing a solution to drive the development of miniaturized wireless medical products," said Martin McHugh, business and technology development manager of advanced packaging for Microsemi. "Our advanced packaging technology can also be paired with our industry-leading, ultra low-power ZL70102 radio to enable wireless healthcare monitoring. Moving forward, we plan to apply our size-reduction techniques and radio technologies to other markets such as smart sensing and applications where size and weight are critical success factors."
The ultra low-power ZL70102 transceiver chip supports a very high data rate RF link for medical implantable communication applications. The chip's unique design allows patient health and device performance data to be quickly transmitted with little impact to the useful battery life of the implanted device. The ZL70102 is designed for use in both implanted medical devices and base stations, and operates in the 402 to 405 MHz MICS band. Multiple low power wake-up options are supported including using 2.45 GHz ISM band wake-up receive option for ultra low-power operation receiver option.