The companies say that this early “pathfinding” work will provide valuable learning to enable physical design IP and methodologies in support of customers who may be enabled to tape-out 10FinFET designs as early as Q4 2015.
TSMC will be applying the lessons learned from prior generations of 20SoC and 16FinFET in the ARM ecosystem to offer performance and power improvements at 10FinFET that will, the company says, be better than at previous nodes. The ARM ecosystem can also take advantage of TSMC's Open Innovation Platform (OIP) which includes a set of ecosystem interfaces and collaborative components initiated and supported by TSMC.
TSMC vice president of R&D Dr. Cliff Hou, notes, “Together with ARM, we proved out in silicon the high performance and low power of the big.LITTLE architecture as implemented in 16FinFET. Given the successful adoption of our previous collaborative efforts, it makes sense that we continue this fruitful partnership with ARM in future 64-bit cores and 10FinFET.”
Cooperation from previous TSMC and ARM collaborations has enabled customers to accelerate their product development cycles and take advantage of leading-edge processes and IP. Recent benefits have included early access to ARM Artisan Physical IP and tape-outs of ARM Cortex-A53 and Cortex-A57 processors on 16FinFET process.