Twin Creeks Technologies (San Jose, California) also claims its ultra-thin manufacturing process is suited to advanced production of LEDs and CMOS image sensors.
Reducing the amount of silicon needed to make solar cells is critical, argues Siva Sivaram, a former Intel manager and CEO of Twin Creeks, since it represents most of the manufacturing cost. Moreover, current solar manufacturing processes use only the upper layers of a silicon wafer, and Sivaram estimates that 90 percent of substrate is not used in the manufacturing process.
Twin Creeks has leveraged a technique called proton-induced exfoliation (PIE) to build a machine that produces extremely thin, flexible wafers. The company is taking the wraps off of a third generation version of its Hyperion wafer production tool this week (March 13), a machine that is says it ready for production. The company’s goal is to use its manufacturing and wafer handling and processing tools to produce monocrystalline wafers less than 1/10th the thickness of conventional wafers currently used to make solar cells.
Such an advance could help reduce solar cell material costs to the point where devices based on ultra-thin wafers would offset much of the price decline seen in the solar panel market over the last 18 months. Twin Creeks claims it lower cell production costs by about 50 percent.
Twin Creeks' third-generation Hyperion wafer tool slices wafers super-thin
The company’s version of PIE technology uses a beam of hydrogen ions to lift a super-thin layer of silicon measuring as little as 20 microns off a wafer that serves as the basis of a solar cell. The company claims the Hyperion machine can produce wafers for solar cells at a cost of about 10 cents per watt. The current cost is about 85 cents per watt. “I don’t want to compete [in the solar market] in taking out the last penny of cost” using traditional manufacturing techniques, says Sivaram.
The third-generation Hyperion tool is