The LSM330 iNEMO module houses a 3-axis digital gyroscope and a 3-axis digital accelerometer with two embedded finite state machines – programmable blocks that enable custom motion recognition inside the module.These enable the identification of specific motions or gestures and initiate associated actions or applications, such as switching on an augmented-reality view of a near-by object by moving the phone with a specific gesture. Integrated processing capability in MEMS sensors helps decrease power consumption in battery-hungry portable devices and brings more freedom and flexibility to the design of motion-enabled consumer electronics.
The module enhances user experience and motion-sensing realism in today’s space-constrained and power-hungry portable consumer devices and shortcuts the path to wearable sensor applications in sports, fitness and healthcare diagnostics.
ST’s newest inertial module detects acceleration up to 16g and angular rate up to 2,000 dps along the pitch, roll and yaw axes. The integration of high-resolution linear- and angular-motion sensing in a single device increases system robustness and the advanced module design ensures superior thermal and mechanical stability. The LSM330 multi-sensor module targets a wide range of applications that include wearable sensor applications, motion-activated user interfaces in phones and tablets; motion detection and map-matching for indoor/outdoor navigation, augmented reality and other location-based services.
Addressing power constraints in battery-operated portable devices, the module includes power-down and sleep modes and an embedded FIFO (first-in first-out) memory block for smarter power management. In addition, it can operate with any supply voltage over the range of 2.4 to 3.6V.
Fully software-compatible with ST’s latest-generation 3-axis digital accelerometers (LIS3DSH) and gyroscopes (L3GD20), the new iNEMO module makes it easy for customers using ST’s single-function sensors to upgrade their designs, reducing the board size, number of external components, and overall application system complexity.
Housed in an ultra-compact 3x3.5x1mm LGA package, the LSM330 6-degrees-of-freedom module will start sampling by the end of Q4 2012 Unit pricing is $4.15 for volumes in the range of 1,000