Updated power/thermal analysis software package

March 14, 2013 // By Paul Buckley
Docea Power has unveiled new releases of the company's Aceplorer 3.1 and AceThermalModeler 2.0 dynamic power and thermal management analysis software.

Aceplorer 3.1 features a new solver for coupled power and thermal transient simulations featuring 1000x performance gains compared with the previous versions and a communication protocol enabling the co-simulation of Aceplorer models with virtual platforms and performance analysis tools.
Aceplorer is Docea Power’s system-level power and thermal modeling and simulation software for early architecture exploration, architecture validation and power budget tracking. AceThermalModeler generates compact thermal models for System on Chips (SoCs), 3D ICs, Systems in Package (SiPs) or complete board.

Aceplorer 3.1 also features a communication protocol for 3rd party tools that enables co-simulation with timed virtual platforms or performance analysis tools. Co-simulation of timed virtual platforms and Aceplorer models allow users to simulate dynamic power and thermal management strategies using real use cases where simulation duration ranges from a few seconds to tens of minutes.

Docea’s dynamic power and thermal management simulations allow system architects to scale the operating point in the performance model with power and temperature feedback provided by Aceplorer’s virtual power model during simulation.

AceThermalModeler 2.0 improves usability and has an enhanced graphical user interface to ease the modeling. Models generated with AceThermalModeler are imported in Aceplorer for transient and steady state thermal response to use case based power stimuli.

Visit Docea Power at www.doceapower.com