VITA 66.1 optical MT backplane interconnect for VPX-architecture

May 01, 2013 // By Graham Prophet
Molex has introduced an optical interconnect using a high-density ferrule-carrier design and robust housing to streamline installation and maintenance in rugged embedded VPX aerospace and defence backplane applications.

The VITA 66.1 ruggedised optical MT backplane interconnect solution for high-density aerospace, defence and commercial embedded system applications is fully compliant with the ANSI-ratified 66.1 specification; the compact VITA 66.1 optical MT backplane solution ensures VPX system engineers optimal simplicity in design and functionality for harsh environments.

“Defence and commercial applications rely on strict VPX compliance for demanding embedded computing systems. Smaller chassis and board-size based equipment needs to be easily accessible for field serviceability,” states Mark Matus, global product manager for rugged interconnects, Molex. “Based on our MT ferrule-carrier design, the VITA 66.1 interconnects reduce installation and maintenance time, plus associated costs, by enabling field servicing without requiring hand tools even in densely populated systems.”

The new Molex VITA 66.1 optical MT interconnect system meets the defined requirements outlined by VITA 66.0 for blind mate fibre optic interconnects used with VITA 46 backplanes and plug-in modules. Available with 8, 12 or 24 fibres in standard singlemode or multimode and VersaBeam (expanded beam) MT ferrule options for design flexibility, the VITA 66.1 interconnect features a robust aluminium housing to withstand extreme temperature ranges (-50 to +105 °C), as well as shock and vibration environments. The anodised aluminium-based housings provide a rugged solution for use in the designated VPX card space as determined by the standard, or can be used as a stand-alone solution outside of the VPX architecture.