X-FAB MEMS facility offers in-house gold processing and post-CMOS processing

June 13, 2012 // By Julien Happich
X-FAB Silicon Foundries announced two major MEMS milestones: the completion of its dedicated noble metal facility for MEMS and post-CMOS processing and shipment of its billionth MEMS device.

The new facility, built specifically for the processing of MEMS, extends X-FAB's existing MEMS capabilities in Erfurt, Germany, and initially adds gold deposition and patterning capability. It can handle approximately 100,000 wafers a year and will process MEMS devices for the rapidly expanding consumer, mobile and computer markets. Work began on the noble metal facility at the end of 2011 and was completed this month on schedule. The full equipment set is installed and being qualified for production. 

Since 1995, the company has manufactured and shipped a billion MEMS devices, including gyroscopes, accelerometers, pressure sensors, thermopiles and microfluidic devices, as well as CMOS integrated MEMS sensors and wafer-level packaged devices for consumer, automotive and medical applications.

www.xfab.com