Bosch has retaken the lead from mCube with its B13L. Bosch has achieved a significant size reduction by using through-silicon vias (TSVs) in the ASIC and by the use of wafer-level chip scale packaging (WLCSP).
The mCube approach is inherently based on the use of TSVs but a different one to Bosch. In the mCube approach the MEMS die is built on top of the ASIC and uses TSVs to make the connections between the functions of the die. This process allows the removal of bonding pads, simplifies the packaging and, combined with the eutectic bonding process of the cap on the MEMS structures, provides very low manufacturing costs.
Reverse engineering and costing reports on these two devices are available here.
New detection principles are about to enter the market, such as NEMS technology from Tronics and CEA Leti and there is a news emphasis on hardware-software functionality as evidenced by a number of recent acquisitions, Xsens by Fairchild, Movea by InvenSense and Sensor Platforms by Audience.
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