The modules are based on the same specifications as Digi’s current 802.15.4-based Series 2 Digi XBee hardware and feature a Silicon Labs EM3587 SoC with 512 kBytes of flash and 64 kBytes of RAM, allowing for full implementation of the full Thread protocol for end nodes and routers, due for release in 2017. The module’s SPI provides a high-speed interface and optimizes integration with embedded microcontrollers.
The Digi XBee S2D modules provide transmit power of 3.1 mW (6.3 mW in boost mode) to offer an indoor transmit range of up to 60m and an outdoor, line-of-site range of over 1 km — in the Digi XBee surface mount footprint and secured by 128-bit AES encryption. Because the modules adhere to the same surface mount footprint as other Digi XBee modules and feature the interoperability of the ZigBee standard, engineers can switch to other frequencies or protocols to expand market reach.
The modules are supported by the Digi XKB2-Z7T-WTZM XBee S2D ZigBee Thread-Ready Mesh Kit, which includes three Digi XBee S2D ZigBee modules, micro-USB cables, and Digi XBee development boards that can be used with the modular Seeed Studio Grove system, which provides interconnect capabilities. The kit is designed for anyone interested in getting started in the world of ZigBee, while making it easy to quickly learn more about ZigBee technology through hands-on examples in the kit.