“Significant interest and uptake” of FinFET technology, says IC design house

August 09, 2013 // By Graham Prophet
Sondrel, a system-to-silicon IC design consultancy, believes that the increasing use of FinFET technology will cause new challenges for IC designers looking to benefit from the scaling benefits the new structures offer. [Image; Synopsys]

Sondrel's Kevin Steptoe, VP Engineering notes that, “At the latest Design Automation Conference in Texas, much of the talk on the show floor concerned FinFETs. Similarly, we are seeing our customers already moving to such multi-gate or tri-gate technologies to benefit from the size reduction, increased integration and higher performance offered by these new structures. This is not as straightforward as moving from one process node to another. Sub-20nm requires users to learn new tools; it’s not simply a matter of shrinking feature sizes and using standard cell placement techniques.”

Adds Sondrel’s CEO Graham Curren: “One of the main reasons for using a specialist design house is that companies simply can’t afford the investment – in time or money – to keep all engineering teams up-to-date on every design new innovation. Our model at Sondrel is to bring specific expertise to the partnership. So, for example, in this instance we have invested heavily to be able to offer a thorough understanding and capability in FinFET IC design.”

Sondrel; www.sondrel.com