X-Fest event showcases interconnect solutions

EDN Europe, 28 Oct 2009

Molex will showcase its interconnect solutions at Avnet’s X-Fest. Sponsored by Xilinx, Molex will showcase its SEARAY board-to-board connector, which meets the VITA 57 FPGA Mezzanine Connector standard. X-Fest events will be hosted in 37 locations throughout Asia, Europe, North America and Japan from October 2009 through February 2010. This global series of technical seminars offer practical, “how-to” training for designers interested in using the new Spartan-6 and Virtex-6 FPGA families from Xilinx. The event will also showcase advanced design techniques, methodologies and implementations, as well as reference designs from multiple manufacturers that can accelerate applications from PCIe to video to wireless to embedded networking. Molex offers a variety of high signal integrity backplane/mid-plane solutions to meet the demand for increased network bandwidth and advanced technology. The company offers power connectors with current ratings up to 150A per circuit. The new EXTreme Power family offers high-current interconnect solutions with improved power densities. The product offering ranges from EXTreme MicroPower 16.0A blades to EXTreme PowerMass 150.0A modules.


With a line-up of high-speed, high-density I/O products, Molex can meet the rigorous interconnect requirements. The company’s high speed edge card connectors offer multiple features and mating options for vertical, right-angle and mid-plane PCB orientations. New contact designs in various circuit sizes provide improved signal integrity at 12.5Gbit/s data rates and beyond, as well as up to 1.5A per circuit of power. For board-to-board design configurations, the company has an array of SMT and through-hole products to meet nearly any design challenge, from a micro-miniature connector like the 0.40mm SlimStack line to a high-density, high-performance mezzanine connector such as the SEARAY family. When it comes to wire-to-wire and wire-to-board configurations, the company provides a range of products from micro-miniature FFC/FPC connectors to the sealed MX150 family and power families such as Micro-Fit 3.0 and Mini-Fit.


 

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